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| 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 1K Microwire Compatible Serial EEPROM Device Selection Table Part Number 93AA46A 93AA46B 93LC46A 93LC46B 93C46A 93C46B 93AA46C 93LC46C 93C46C VCC Range 1.8-5.5 1.8-5-5 2.5-5.5 2.5-5.5 4.5-5.5 4.5-5.5 1.8-5.5 2.5-5.5 4.5-5.5 ORG Pin No No No No No No Yes Yes Yes Word Size 8-bit 16-bit 8-bit 16-bit 8-bit 16-bit 8- or 16-bit 8- or 16-bit 8- or 16-bit Temp Ranges I I I, E I, E I, E I, E I I, E I, E Packages P, SN, ST, MS, OT, MC P, SN, ST, MS, OT, MC P, SN, ST, MS, OT, MC P, SN, ST, MS, OT, MC P, SN, ST, MS, OT, MC P, SN, ST, MS, OT, MC P, SN, ST, MS, MC P, SN, ST, MS, MC P, SN, ST, MS, MC Features: * * * * * * * * * * * * * * Low-Power CMOS Technology ORG Pin to Select Word Size for `46C' Version 128 x 8-bit Organization `A' Devices (no ORG) 64 x 16-bit Organization `B' Devices (no ORG) Self-Timed Erase/Write Cycles (including Auto-Erase) Automatic Erase All (ERAL) Before Write All (WRAL) Power-On/Off Data Protection Circuitry Industry Standard 3-Wire Serial I/O Device Status Signal (Ready/Busy) Sequential Read Function 1,000,000 Erase/Write Cycles Data Retention > 200 Years Pb-free and RoHS Compliant Temperature Ranges Supported: - Industrial (I) -40C to +85C - Automotive (E) -40C to +125C Pin Function Table Name CS CLK DI DO VSS NC ORG VCC Chip Select Serial Data Clock Serial Data Input Serial Data Output Ground No internal connection Memory Configuration Power Supply Function Description: The Microchip Technology Inc. 93XX46A/B/C devices are 1Kbit low-voltage serial Electrically Erasable PROMs (EEPROM). Word-selectable devices such as the 93AA46C, 93LC46C or 93C46C are dependent upon external logic levels driving the ORG pin to set word size. For dedicated 8-bit communication, the 93AA46A, 93LC46A or 93C46A devices are available, while the 93AA46B, 93LC46B and 93C46B devices provide dedicated 16-bit communication. Advanced CMOS technology makes these devices ideal for lowpower, nonvolatile memory applications. The entire 93XX Series is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead MSOP, 6-lead SOT-23, 8-lead 2x3 DFN and 8-lead TSSOP. All packages are Pb-free (Matte Tin) finish. 2010 Microchip Technology Inc. DS21749H-page 1 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C Package Types (not to scale) ROTATED SOIC (ex: 93LC46BX) NC VCC CS CLK 1 2 3 4 8 ORG* 7 VSS 6 DO 5 DI CS CLK DI DO PDIP/SOIC (P, SN) 1 2 3 4 8 7 6 5 VCC NC ORG* VSS TSSOP/MSOP (ST, MS) CS CLK DI DO 1 2 3 4 8 7 6 5 VCC NC ORG* VSS DO VSS DI SOT-23 (OT) 1 2 3 6 5 4 VCC CS CLK DFN (MC) CS CLK DI DO 1 2 3 4 8 7 6 5 VCC NC ORG* VSS *ORG pin is NC on A/B devices DS21749H-page 2 2010 Microchip Technology Inc. 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings() VCC.............................................................................................................................................................................7.0V All inputs and outputs w.r.t. VSS ..........................................................................................................-0.6V to VCC +1.0V Storage temperature ...............................................................................................................................-65C to +150C Ambient temperature with power applied................................................................................................-40C to +125C ESD protection on all pins 4 kV NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS Industrial (I): TA = -40C to +85C, VCC = +1.8V TO +5.5V Automotive (E): TA = -40C to +125C, VCC = +2.5V TO +5.5V Min. 2.0 0.7 VCC -0.3 -0.3 -- -- 2.4 VCC - 0.2 -- -- -- -- -- -- -- -- -- -- Typ -- -- -- -- -- -- -- -- -- -- -- -- 500 -- -- 100 -- -- Max. VCC +1 VCC +1 0.8 0.2 VCC 0.4 0.2 -- -- 1 1 7 2 -- 1 500 -- 1 5 Units V V V V V V V V A A pF mA A mA A A A A Conditions VCC 2.7V VCC 2.7V VCC 2.7V VCC 2.7V IOL = 2.1 mA, VCC = 4.5V IOL = 100 A, VCC = 2.5V IOH = -400 A, VCC = 4.5V IOH = -100 A, VCC = 2.5V VIN = VSS or VCC VOUT = VSS or VCC VIN/VOUT = 0V (Note 1) TA = 25C, FCLK = 1 MHz FCLK = 3 MHz, VCC = 5.5V FCLK = 2 MHz, VCC = 2.5V FCLK = 3 MHz, VCC = 5.5V FCLK = 2 MHz, VCC = 3.0V FCLK = 2 MHz, VCC = 2.5V I-Temp E-Temp CLK = CS = 0V ORG = DI = VSS or VCC (Note 2) (Note 3) (Note 1) 93AA46A/B/C, 93LC46A/B/C 93C46A/B/C All parameters apply over the specified ranges unless otherwise noted. Param. No. D1 D2 D3 D4 D5 D6 D7 D8 D9 Symbol VIH1 VIH2 VIL1 VIL2 VOL1 VOL2 VOH1 VOH2 ILI ILO CIN, COUT ICC write Parameter High-level input voltage Low-level input voltage Low-level output voltage High-level output voltage Input leakage current Output leakage current Pin capacitance (all inputs/outputs) Write current ICC read Read current D10 ICCS Standby current D11 VPOR VCC voltage detect -- -- 1.5 3.8 -- -- V V Note 1: This parameter is periodically sampled and not 100% tested. 2: ORG pin not available on `A' or `B' versions. 3: Ready/Busy status must be cleared from DO; see Section 3.4 "Data Out (DO)". 2010 Microchip Technology Inc. DS21749H-page 3 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C TABLE 1-2: AC CHARACTERISTICS Industrial (I): TA = -40C to +85C, VCC = +1.8V TO +5.5V Automotive (E): TA = -40C to +125C, VCC = +2.5V TO +5.5V Min. -- Max. 3 2 1 -- Units MHz MHz MHz ns ns ns ns ns ns ns ns ns ns ns ns Conditions 4.5VVCC 5.5V, 93XX46C only 2.5V VCC 5.5V 1.8V VCC 2.5V 4.5VVCC 5.5V, 93XX46C only 2.5V VCC 5.5V 1.8V VCC 2.5V 4.5VVCC 5.5V, 93XX46C only 2.5V VCC 5.5V 1.8V VCC 2.5V 4.5VVCC 5.5V 2.5V VCC 4.5V 1.8V VCC 2.5V 1.8V VCC 5.5V 1.8V VCC 5.5V 4.5VVCC 5.5V, 93XX46C only 2.5V VCC 5.5V 1.8V VCC 2.5V 4.5VVCC 5.5V, 93XX46C only 2.5V VCC 5.5V 1.8V VCC 2.5V 4.5VVCC 5.5V, CL = 100 pF 2.5V VCC 4.5V, CL = 100 pF 1.8V VCC 2.5V, CL = 100 pF 4.5VVCC 5.5V, (Note 1) 1.8VVCC 4.5V, (Note 1) 4.5VVCC 5.5V, CL = 100 pF 2.5V VCC 4.5V, CL = 100 pF 1.8V VCC 2.5V, CL = 100 pF Erase/Write mode (AA and LC versions) Erase/Write mode (93C versions) ERAL mode, 4.5V VCC 5.5V WRAL mode, 4.5V VCC 5.5V All parameters apply over the specified ranges unless otherwise noted. Param. No. A1 Symbol FCLK Parameter Clock frequency A2 TCKH Clock high time 200 250 450 100 200 450 50 100 250 0 250 50 100 250 50 100 250 -- -- -- -- -- -- A3 TCKL Clock low time -- A4 TCSS Chip Select setup time -- A5 A6 A7 TCSH TCSL TDIS Chip Select hold time Chip Select low time Data input setup time -- -- -- A8 TDIH Data input hold time -- ns A9 TPD Data output delay time 200 250 400 100 200 200 300 500 6 2 6 15 -- ns A10 A11 TCZ TSV Data output disable time Status valid time ns ns A12 A13 A14 A15 A16 TWC TWC TEC TWL -- Program cycle time -- -- -- -- ms ms ms ms Endurance 1M cycles 25C, VCC = 5.0V, (Note 2) Note 1: This parameter is periodically sampled and not 100% tested. 2: This application is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total EnduranceTM Model, which may be obtained from Microchip's web site at www.microchip.com. DS21749H-page 4 2010 Microchip Technology Inc. 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C FIGURE 1-1: CS VIH VIL VIH CLK VIL TDIS VIH DI VIL DO (Read) DO (Program) Note: VOH VOL VOH VOL Status Valid TSV TPD TPD TCZ TDIH TCSS TCKH TCKL TCSH SYNCHRONOUS DATA TIMING TCZ TSV is relative to CS. TABLE 1-3: INSTRUCTION SET FOR X16 ORGANIZATION (93XX46B OR 93XX46C WITH ORG = 1) Instruction ERASE ERAL EWDS EWEN READ WRITE WRAL SB 1 1 1 1 1 1 1 Opcode 11 00 00 00 10 01 00 A5 1 0 1 A5 A5 0 A4 0 0 1 A4 A4 1 Address A3 X X X A3 A3 X A2 X X X A2 A2 X A1 X X X A1 A1 X A0 X X X A0 A0 X Data In -- -- -- -- -- D15 - D0 D15 - D0 Data Out (RDY/BSY) (RDY/BSY) High-Z High-Z D15 - D0 (RDY/BSY) (RDY/BSY) Req. CLK Cycles 9 9 9 9 25 25 25 TABLE 1-4: INSTRUCTION SET FOR X8 ORGANIZATION (93XX46A OR 93XX46C WITH ORG = 0) Instruction ERASE ERAL EWDS EWEN READ WRITE WRAL SB 1 1 1 1 1 1 1 Opcode 11 00 00 00 10 01 00 Address A6 A5 A4 A3 A2 A1 A0 1 0 1 0 0 1 X X X X X X X X X X X X X X X Data In -- -- -- -- -- D7 - D0 D7 - D0 Data Out (RDY/BSY) (RDY/BSY) High-Z High-Z D7 - D0 (RDY/BSY) (RDY/BSY) Req. CLK Cycles 10 10 10 10 18 18 18 A6 A5 A4 A3 A2 A1 A0 A6 A5 A4 A3 A2 A1 A0 0 1 X X X X X 2010 Microchip Technology Inc. DS21749H-page 5 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 2.0 FUNCTIONAL DESCRIPTION 2.3 Data Protection When the ORG pin (93XX46C) is connected to VCC, the (x16) organization is selected. When it is connected to ground, the (x8) organization is selected. Instructions, addresses and write data are clocked into the DI pin on the rising edge of the clock (CLK). The DO pin is normally held in a High-Z state except when reading data from the device, or when checking the Ready/ Busy status during a programming operation. The Ready/Busy status can be verified during an erase/ write operation by polling the DO pin; DO low indicates that programming is still in progress, while DO high indicates the device is ready. DO will enter the High-Z state on the falling edge of CS. All modes of operation are inhibited when VCC is below a typical voltage of 1.5V for `93AA' and `93LC' devices or 3.8V for `93C' devices. The EWEN and EWDS commands give additional protection against accidentally programming during normal operation. Note: For added protection, an EWDS command should be performed after every write operation and an external 10 k pulldown protection resistor should be added to the CS pin. 2.1 Start Condition The Start bit is detected by the device if CS and DI are both high with respect to the positive edge of CLK for the first time. Before a Start condition is detected, CS, CLK and DI may change in any combination (except to that of a Start condition), without resulting in any device operation (Read, Write, Erase, EWEN, EWDS, ERAL or WRAL). As soon as CS is high, the device is no longer in Standby mode. An instruction following a Start condition will only be executed if the required opcode, address and data bits for any particular instruction are clocked in. Note: When preparing to transmit an instruction, either the CLK or DI signal levels must be at a logic low as CS is toggled active high. After power-up, the device is automatically in the EWDS mode. Therefore, an EWEN instruction must be performed before the initial ERASE or WRITE instruction can be executed. Block Diagram VCC VSS Address Decoder Address Counter Data Register DI ORG* CS CLK Mode Decode Logic Clock Register Output Buffer DO Memory Array 2.2 Data In/Data Out (DI/DO) It is possible to connect the Data In and Data Out pins together. However, with this configuration it is possible for a "bus conflict" to occur during the "dummy zero" that precedes the read operation if A0 is a logic high level. Under such a condition the voltage level seen at Data Out is undefined and will depend upon the relative impedances of Data Out and the signal source driving A0. The higher the current sourcing capability of A0, the higher the voltage at the Data Out pin. In order to limit this current, a resistor should be connected between DI and DO. *ORG input is not available on A/B devices DS21749H-page 6 2010 Microchip Technology Inc. 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 2.4 Erase The ERASE instruction forces all data bits of the specified address to the logical `1' state. CS is brought low following the loading of the last address bit. This falling edge of the CS pin initiates the self-timed programming cycle, except on `93C' devices where the rising edge of CLK before the last address bit initiates the write cycle. The DO pin indicates the Ready/Busy status of the device if CS is brought high after a minimum of 250 ns low (TCSL). DO at logical `0' indicates that programming is still in progress. DO at logical `1' indicates that the register at the specified address has been erased and the device is ready for another instruction. Note: After the Erase cycle is complete, issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO. FIGURE 2-1: CS ERASE TIMING FOR 93AA AND 93LC DEVICES TCSL Check Status CLK DI 1 1 1 AN AN-1 AN-2 *** A0 TSV TCZ Ready DO High-Z Busy TWC High-Z FIGURE 2-2: CS ERASE TIMING FOR 93C DEVICES TCSL Check Status CLK DI 1 1 1 AN AN-1 AN-2 *** A0 TSV TCZ Ready DO High-Z Busy TWC High-Z 2010 Microchip Technology Inc. DS21749H-page 7 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 2.5 Erase All (ERAL) The Erase All (ERAL) instruction will erase the entire memory array to the logical `1' state. The ERAL cycle is identical to the erase cycle, except for the different opcode. The ERAL cycle is completely self-timed and commences at the falling edge of the CS, except on `93C' devices where the rising edge of CLK before the last data bit initiates the write cycle. Clocking of the CLK pin is not necessary after the device has entered the ERAL cycle. The DO pin indicates the Ready/Busy status of the device if CS is brought high after a minimum of 250 ns low (TCSL). Note: After the ERAL command is complete, issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO. VCC must be 4.5V for proper operation of ERAL. FIGURE 2-3: CS ERAL TIMING FOR 93AA AND 93LC DEVICES TCSL Check Status CLK DI 1 0 0 1 0 x *** x TSV TCZ Ready DO High-Z Busy TEC High-Z VCC must be 4.5V for proper operation of ERAL. FIGURE 2-4: CS ERAL TIMING FOR 93C DEVICES TCSL Check Status CLK DI 1 0 0 1 0 x *** x TSV TCZ Ready High-Z DO High-Z Busy TEC DS21749H-page 8 2010 Microchip Technology Inc. 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 2.6 Erase/Write Disable and Enable (EWDS/EWEN) enabled until an EWDS instruction is executed or Vcc is removed from the device. To protect against accidental data disturbance, the EWDS instruction can be used to disable all erase/write functions and should follow all programming operations. Execution of a READ instruction is independent of both the EWEN and EWDS instructions. The 93XX46A/B/C powers up in the Erase/Write Disable (EWDS) state. All programming modes must be preceded by an Erase/Write Enable (EWEN) instruction. Once the EWEN instruction is executed, programming remains FIGURE 2-5: CS EWDS TIMING TCSL CLK DI 1 0 0 0 0 x *** x FIGURE 2-6: EWEN TIMING TCSL CS CLK DI 1 0 0 1 1 x *** x 2.7 Read The READ instruction outputs the serial data of the addressed memory location on the DO pin. A dummy zero bit precedes the 8-bit (if ORG pin is low or A-version devices) or 16-bit (if ORG pin is high or B-version devices) output string. The output data bits will toggle on the rising edge of the CLK and are stable after the specified time delay (TPD). Sequential read is possible when CS is held high. The memory data will automatically cycle to the next register and output sequentially. FIGURE 2-7: CS READ TIMING CLK DI 1 1 0 AN *** A0 DO High-Z 0 Dx *** D0 Dx *** D0 Dx *** D0 2010 Microchip Technology Inc. DS21749H-page 9 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 2.8 Write The WRITE instruction is followed by 8 bits (if ORG is low or A-version devices) or 16 bits (if ORG pin is high or B-version devices) of data, which are written into the specified address. For 93AA46A/B/C and 93LC46A/B/C devices, after the last data bit is clocked into DI, the falling edge of CS initiates the self-timed auto-erase and programming cycle. For 93C46A/B/C devices, the selftimed auto-erase and programming cycle is initiated by the rising edge of CLK on the last data bit. The DO pin indicates the Ready/Busy status of the device if CS is brought high after a minimum of 250 ns low (TCSL). DO at logical `0' indicates that programming is still in progress. DO at logical `1' indicates that the register at the specified address has been written with the data specified and the device is ready for another instruction. Note: After the Write cycle is complete, issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO. FIGURE 2-8: CS WRITE TIMING FOR 93AA AND 93LC DEVICES TCSL CLK DI 1 0 1 AN *** A0 Dx *** D0 TSV TCZ Ready DO High-Z Busy TWC High-Z FIGURE 2-9: CS WRITE TIMING FOR 93C DEVICES TCSL CLK DI 1 0 1 AN *** A0 Dx *** D0 TSV TCZ Ready DO High-Z Busy TWC High-Z DS21749H-page 10 2010 Microchip Technology Inc. 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 2.9 Write All (WRAL) The Write All (WRAL) instruction will write the entire memory array with the data specified in the command. For 93AA46A/B/C and 93LC46A/B/C devices, after the last data bit is clocked into DI, the falling edge of CS initiates the self-timed auto-erase and programming cycle. For 93C46A/B/C devices, the self-timed autoerase and programming cycle is initiated by the rising edge of CLK on the last data bit. Clocking of the CLK pin is not necessary after the device has entered the WRAL cycle. The WRAL command does include an automatic ERAL cycle for the device. Therefore, the WRAL instruction does not require an ERAL instruction, but the chip must be in the EWEN status. The DO pin indicates the Ready/Busy status of the device if CS is brought high after a minimum of 250 ns low (TCSL). Note: After the Write All cycle is complete, issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO. VCC must be 4.5V for proper operation of WRAL. FIGURE 2-10: CS WRAL TIMING FOR 93AA AND 93LC DEVICES TCSL CLK DI 1 0 0 0 1 x *** x Dx *** D0 TSV TCZ Ready DO High-Z Busy TWL HIGH-Z VCC must be 4.5V for proper operation of WRAL. FIGURE 2-11: CS WRAL TIMING FOR 93C DEVICES TCSL CLK DI 1 0 0 0 1 x *** x Dx *** D0 TSV TCZ Ready DO High-Z Busy HIGH-Z TWL 2010 Microchip Technology Inc. DS21749H-page 11 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 3.0 PIN DESCRIPTIONS PIN DESCRIPTIONS SOIC/PDIP/ MSOP/ TSSOP/DFN 1 2 3 4 5 6 7 8 SOT-23 5 4 3 1 2 -- -- 6 Rotated SOIC 3 4 5 6 7 8 1 2 Chip Select Serial Clock Data In Data Out Ground Organization/93XX46C No Internal Connection/93XX46A/B No Internal Connection Power Supply Function TABLE 3-1: Name CS CLK DI DO Vss ORG/NC NC VCC 3.1 Chip Select (CS) 3.3 Data In (DI) A high level selects the device; a low level deselects the device and forces it into Standby mode. However, a programming cycle that is already in progress will be completed, regardless of the Chip Select (CS) input signal. If CS is brought low during a program cycle, the device will go into Standby mode as soon as the programming cycle is completed. CS must be low for 250 ns minimum (TCSL) between consecutive instructions. If CS is low, the internal control logic is held in a Reset status. Data In (DI) is used to clock in a Start bit, opcode, address and data synchronously with the CLK input. 3.4 Data Out (DO) Data Out (DO) is used in the Read mode to output data synchronously with the CLK input (TPD after the positive edge of CLK). This pin also provides Ready/Busy status information during erase and write cycles. Ready/Busy status information is available on the DO pin if CS is brought high after being low for minimum Chip Select low time (TCSL) and an erase or write operation has been initiated. The Status signal is not available on DO if CS is held low during the entire erase or write cycle. In this case, DO is in the High-Z mode. If status is checked after the erase/write cycle, the data line will be high to indicate the device is ready. Note: After a programming cycle is complete, issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO. 3.2 Serial Clock (CLK) The Serial Clock is used to synchronize the communication between a master device and the 93XX series device. Opcodes, address and data bits are clocked in on the positive edge of CLK. Data bits are also clocked out on the positive edge of CLK. CLK can be stopped anywhere in the transmission sequence (at high or low level) and can be continued anytime with respect to clock high time (TCKH) and clock low time (TCKL). This gives the controlling master freedom in preparing opcode, address and data. CLK is a "don't care" if CS is low (device deselected). If CS is high, but the Start condition has not been detected (DI = 0), any number of clock cycles can be received by the device without changing its status (i.e., waiting for a Start condition). CLK cycles are not required during the self-timed write (i.e., auto erase/write) cycle. After detection of a Start condition the specified number of clock cycles (respectively low-to-high transitions of CLK) must be provided. These clock cycles are required to clock in all required opcode, address and data bits before an instruction is executed. CLK and DI then become "don't care" inputs waiting for a new Start condition to be detected. 3.5 Organization (ORG) When the ORG pin is connected to VCC or Logic HI, the (x16) memory organization is selected. When the ORG pin is tied to VSS or Logic LO, the (x8) memory organization is selected. For proper operation, ORG must be tied to a valid logic level. 93XX46A devices are always (x8) organization and 93XX46B devices are always (x16) organization. DS21749H-page 12 2010 Microchip Technology Inc. 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 4.0 4.1 PACKAGING INFORMATION Package Marking Information 8-Lead MSOP (150 mil) XXXXXXT YWWNNN Example: 3L46BI 5281L7 6-Lead SOT-23 XXNN Example: 1EL7 8-Lead PDIP XXXXXXXX T/XXXNNN YYWW Example: 93LC46B I/P e3 1L7 0528 8-Lead SOIC Example: XXXXXXXT XXXXYYWW NNN 93LC46BI SN e3 0528 1L7 8-Lead Rotated SOIC Example: XXXXXXXT XXXXYYWW NNN 93L46BXI SN e3 0528 1L7 8-Lead TSSOP XXXX TYWW NNN Example: L46B I528 1L7 8-Lead 2x3 DFN XXX YWW NN Example: 314 528 L7 2010 Microchip Technology Inc. DS21749H-page 13 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 1st Line Marking Codes Part Number TSSOP A46A A46B A46C L46A L46B L46C C46A C46B C46C MSOP 3A46AT 3A46BT 3A46CT 3L46AT 3L46BT 3L46CT 3C46AT 3C46BT 3C46CT SOT-23 I Temp. 1BNN 1LNN -- 1ENN 1PNN -- 1HNN 1TNN -- E Temp. -- -- -- 1FNN 1RNN -- 1JNN 1UNN -- I Temp. 301 311 321 304 314 324 307 317 327 DFN E Temp. -- -- -- 305 315 325 308 318 328 93AA46A 93AA46B 93AA46C 93LC46A 93LC46B 93LC46C 93C46A 93C46B 93C46C Note: T = Temperature grade (I, E) NN = Alphanumeric traceability code Legend: XX...X T Y YY WW NNN e3 Note: Part number or part number code Temperature (I, E) Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) For very small packages with no room for the Pb-free JEDEC designator e3 , the marking will only appear on the outer carton or reel label. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 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DS21749H-page 15 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21749H-page 16 2010 Microchip Technology Inc. 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C /HDG 3ODVWLF 6PDOO 2XWOLQH 7UDQVLVWRU 27 >627@ 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ b N 4 E E1 PIN 1 ID BY LASER MARK 1 2 e e1 D 3 A A2 c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icrochip Technology Inc. DS21749H-page 17 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21749H-page 18 2010 Microchip Technology Inc. 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C /HDG 3ODVWLF 'XDO ,Q/LQH 3 PLO %RG\ >3',3@ 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ N NOTE 1 E1 1 2 D 3 E A A2 A1 L c e b1 b 8QLWV 'LPHQVLRQ /LPLWV 1XPEHU RI 3LQV 3LWFK 7RS WR 6HDWLQJ 3ODQH 0ROGHG 3DFNDJH 7KLFNQHVV %DVH WR 6HDWLQJ 3ODQH 6KRXOGHU WR 6KRXOGHU :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK 7LS WR 6HDWLQJ 3ODQH /HDG 7KLFNQHVV 8SSHU /HDG :LGWK /RZHU /HDG :LGWK 2YHUDOO 5RZ 6SDFLQJ 1 H $ $ $ ( ( ' / F E E H% 0,1 eB ,1&+(6 120 %6& 0$; 1RWHV 3LQ YLVXDO LQGH[ IHDWXUH PD\ YDU\ EXW PXVW EH ORFDWHG ZLWK WKH KDWFKHG DUHD 6LJQLILFDQW &KDUDFWHULVWLF 'LPHQVLRQV ' DQG ( GR QRW LQFOXGH PROG IODVK RU SURWUXVLRQV 0ROG IODVK RU SURWUXVLRQV VKDOO QRW H[FHHG SHU VLGH 'LPHQVLRQLQJ DQG WROHUDQFLQJ SHU $60( <0 %6& %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% 2010 Microchip Technology Inc. DS21749H-page 19 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21749H-page 20 2010 Microchip Technology Inc. 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2010 Microchip Technology Inc. DS21749H-page 21 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C /HDG 3ODVWLF 6PDOO 2XWOLQH 61 1DUURZ PP %RG\ >62,&@ 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS21749H-page 22 2010 Microchip Technology Inc. 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C /HDG 3ODVWLF 7KLQ 6KULQN 6PDOO 2XWOLQH 67 PP %RG\ >76623@ 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D N E E1 NOTE 1 1 b 2 e c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icrochip Technology Inc. DS21749H-page 23 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21749H-page 24 2010 Microchip Technology Inc. 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C /HDG 3ODVWLF 'XDO )ODW 1R /HDG 3DFNDJH 0& [[ PP %RG\ >')1@ 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D N L e b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icrochip Technology Inc. DS21749H-page 25 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C /HDG 3ODVWLF 'XDO )ODW 1R /HDG 3DFNDJH 0& [[ PP %RG\ >')1@ 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS21749H-page 26 2010 Microchip Technology Inc. 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C APPENDIX A: Revision D Corrections to Section 1.0, Electrical Characteristics. Section 4.1, 6-Lead SOT-23 package to OT. REVISION HISTORY Revision E Added DFN package. Revision F Added notes throughout. Revision G (5/2008) Revised Figures 2-1 through 2-4 and Figures 2-8 through 2-11; Revised Package Marking Information; Replaced Package Drawings; Revised Product ID section. Revision H (08/2010) Added 8-Lead Rotated SOIC marking information; Revised Package Drawings; Revised Product ID System. 2010 Microchip Technology Inc. DS21749H-page 27 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C NOTES: DS21749H-page 28 2010 Microchip Technology Inc. 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: * * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. 2010 Microchip Technology Inc. DS21749H-page 29 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: RE: Technical Publications Manager Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Literature Number: DS21749H FAX: (______) _________ - _________ Device: 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21749H-page 30 2010 Microchip Technology Inc. 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X X X /XX Package X Lead Finish Examples: a) b) c) d) 93AA46C-I/MS: 1K, 128x8 or 64x16 Serial EEPROM, MSOP package, 1.8V 93AA46B-I/MS: 1K, 64x16 Serial EEPROM, MSOP package, 1.8V 93AA46AT-I/OT: 1K, 128x8 Serial EEPROM, SOT-23 package, tape and reel, 1.8V 93AA46CT-I/MS: 1K, 128x8 or 16x16 Serial EEPROM, MSOP package, tape and reel, 1.8V 93LC46A-I/MS: 1K, 128x8 Serial EEPROM, MSOP package, 2.5V 93LC46BT-I/OT: 1K, 64x16 Serial EEPROM, SOT-23 package, tape and reel, 2.5V 93LC46B-I/MS: 1K, 64x16 Serial EEPROM, MSOP package, 2.5V 93C46B-I/MS: 1K, 64x16 Serial EEPROM, MSOP package, 5.0V 93C46C-I/MS: 1K, 128x8 or 16x16 Serial EEPROM, MSOP package, 5.0V 93C46AT-I/OT: 1K, 128x8 Serial EEPROM, SOT-23 package, tape and reel, 5.0V 93C46BX-I/SO: 1K, 64x16 Serial EEPROM, Rotated SOIC Package, 5.0V Pinout Tape & Reel Temperature Range Device: 93AA46A: 1K 1.8V Microwire Serial EEPROM 93AA46B: 1K 1.8V Microwire Serial EEPROM 93AA46C: 1K 1.8V Microwire Serial EEPROM w/ORG 93LC46A: 1K 2.5V Microwire Serial EEPROM 93LC46B: 1K 2.5V Microwire Serial EEPROM 93LC46C: 1K 2.5V Microwire Serial EEPROM w/ORG 93C46A: 93C46B: 93C46C: 1K 5.0V Microwire Serial EEPROM 1K 5.0V Microwire Serial EEPROM 1K 5.0V Microwire Serial EEPROM w/ORG Standard pinout Rotated pinout (SOIC only) Standard packaging Tape & Reel -40C to +85C -40C to +125C Plastic MSOP (Micro Small outline, 8-lead) SOT-23, 6-lead (Tape & Reel only) Plastic DIP (300 mil body), 8-lead Plastic SOIC (150 mil body), 8-lead TSSOP, 8-lead 2x3 DFN, 8-lead a) b) c) Pinout: Blank = X = Blank = T = I E MS OT P SN ST MC = = = = = = = = a) b) c) d) Tape & Reel: Temperature Range: Package: 2010 Microchip Technology Inc. DS21749H-page 31 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C NOTES: DS21749H-page 32 2010 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-471-1 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2010 Microchip Technology Inc. DS21749H-page 33 Worldwide Sales and Service AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan - Kaohsiung Tel: 886-7-213-7830 Fax: 886-7-330-9305 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 08/04/10 DS21749H-page 34 2010 Microchip Technology Inc. |
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